Popular
-
Silicon Interposer & Silicon Bridge – Built for Advanced Packaging
-
100% Inspection (Full inspection)
-
45W 16.2V Monocrystalline Silicon Glass Panel Double Glass Customized BIPV For Industry House Home Use
-
2026 Top 7 Industrial Air Filters for Manufacturing
-
2026 Top 7 Filter Cartridge Brands by User Ratings
Silicon Interposer & Silicon Bridge – Built for Advanced Packaging
We provide silicon-based Interposer and Silicon Bridge packaging solutions that support multi-chip integration and high-density interconnects.
Interposer & Silicon Bridge Solutions
|
Parameter |
Specification |
|
Products |
➢ Si Interposer ➢ Si Bridge ➢ Si capacitor |
|
Cap. Integration |
➢ Decoupling：2000 nF/mm^2 ➢ RF：5 nF/mm^2 |
|
Interconnection |
➢ fangzhen5 Cu + 1 AL ➢ bump pitch < 40μm ➢ TSV pitch < 50μm |
|
Design and Simulation |
➢ 3D HFSS/EM ➢ Thermal stress ➢ Power integrity ➢ Signal integrity ➢ Power network ➢ Standard HBM3、UCIe2.0 ➢ DFT design and reliability |
Key Features
· Low RF loss, high thermal conductivity.
· High-density routing supports multi-chip integration.
· Enables vertical interconnects and power delivery.
· Supports signal, power, and ground layer design.
· Compatible with various soldering and bonding processes.
· High-density interconnect, low latency, high signal integrity, customizable design.
Interposer & Silicon Bridge – Silicon Interposer and Silicon Bridge
Packaging Solutions
We provide silicon-based Interposer and Silicon Bridge packaging solutions
that support multi-chip integration and high-density interconnects. Through
Through-Silicon Vias (TSV) and micro-bump technologies, these solutions enable
high-frequency, low-loss signal transmission and power distribution. They are
applicable in advanced packaging, Chiplet design, high-frequency optical
modules, and high-performance computing, offering customers customized, highly
integrated system-level packaging support.
Related products
-
Quick View
HGuide O360 INS/GNSS
Contact UsThe HGuide o360 is a single-card INS/GNSS, all attitude Inertial/GNSS Navigator designed for any platform where high performance navigation data is required in an ultra-low SWAP package.
-
Quick View
PCBA Assembly for Electric Vehicle Charging Infrastructure
Contact UsOur EV Charging Station PCBA is designed for modern electric vehicle charging applications, delivering safe, stable, and durable performance under high current and high-voltage conditions.
-
Quick View
DS-RF Selective Formaldehyde module HCHO Module
Contact UsDS-RF selective formaldehyde module can detect HCHO, VOC, TVOC, t & RH at the same time.
-
Quick View
HG4930 MEMS Inertial Measurement Unit
Contact UsThe HG4930 is a high-performance microelectromechanical systems (MEMS) inertial measurement unit (IMU) designed to meet the needs of a wide range of market applications in agriculture, AUV, industrial equipment, robotics, survey/mapping, stabilization platforms, transportation, unmanned aerial vehicles (UAVs), and unmanned ground vehicles (UGVs).
Reviews
There are no reviews yet.