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Small vacuum plasma device（PR60L ， PR80L）
High precision, fast response, good handling and compatibility, perfect functions and professional technical support.
|
Number |
Project |
Technical Parameter |
|
1 |
Specifications of the whole machine |
PR60L：920mm(W) × 960mm(D) × 1720mm（H） PR80L：920mm(W) ×1030mm(D)×1720mm（H） |
|
2 |
Vacuum chamber specifications |
PR60L: Imported aluminum400(W) ×400(H)×400(D)mm PR80L: Imported aluminum450(W) ×400(H)×450(D)mm |
|
3 |
Electrode plate specifications |
PR60L：6 layer flat plate electrode plate （380(W)×310(D)mm） PR80L：8 layer flat plate electrode plate （420(W)×360(D)mm） |
|
4 |
Control system |
Touch screen + PLC control |
|
5 |
Vacuum measurement system |
Pirani resistance vacuum gauge |
|
6 |
Gas metering system |
Precision mass flow control meterMFC |
|
7 |
Number of gas pathways |
2 channels intake, 1 way venting |
|
8 |
Plasma generator |
500W&1KWPlasma generation source，40KHz （selectable13.56MHz） |
|
9 |
Working gases |
2 working gases are optional：Ar2、N2、H2、O2 |
|
Features |
High precision, fast response, good handling and compatibility, perfect functions and professional technical support. |
|
|
Industry |
It is suitable for cameras and industries, mobile phone manufacturing, semiconductor IC fields, silica gel, plastics, polymer fields, automotive electronics industry, aviation industry, etc. |
|
|
Application |
1. Camera and fingerprint recognition industry: Oxidation removal on the surface of the gold PAD of the soft hard bonding board; IR surface cleaning and cleansing; 2. In the field of semiconductor ICs, COB, COG, COF, ACF processes are used for cleaning before wire bonding and soldering; 3. Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymer. |
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